Systems and methods related to power amplification and power supply control

ABSTRACT

Systems and methods related to power amplification and power supply control. A power amplification control system can include an interface configured to receive a transceiver control signal from a transceiver. The power amplification control system can include a power amplifier control component configured to generate a power amplifier control signal based on the transceiver control signal from the transceiver and a power supply control component configured to generate a power supply control signal based on the transceiver control signal from the transceiver and to generate the power supply control signal based on a local control signal from the power amplifier control component.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/686,177, filed Nov. 17, 2019, entitled “SYSTEMS AND METHODS RELATEDTO POWER AMPLIFICATION AND POWER SUPPLY CONTROL,” which is acontinuation of U.S. patent application Ser. No. 14/867,209, filed Sep.28, 2015, entitled “POWER AMPLIFIER MODULE WITH POWER SUPPLY CONTROL,”now U.S. Pat. No. 10,483,926, issued Nov. 19, 2019, which claimspriority to U.S. Provisional Application No. 62/116,463, filed Feb. 15,2015, entitled “SWITCHING MODE POWER SUPPLY CONTROLLED BY POWERAMPLIFIER MASTER,” the disclosure of each of which is hereby expresslyincorporated by reference herein in its entirety.

BACKGROUND Field

The present disclosure generally relates to power amplification systems.

Description of the Related Art

Some wireless communication devices include both a power amplifier (PA)and a switching mode power supply (SMPS). The SMPS and PA can becontrolled independently by a modem/transceiver system. As a result,there is limited ability for the SMPS to be adjusted as a function of PAoperating conditions.

SUMMARY

In accordance with some implementations, the present disclosure relatesto a power amplification control system. The power amplification controlsystem includes an interface configured to receive a transceiver controlsignal from a transceiver. The power amplification control systemincludes a power amplifier control component configured to generate apower amplifier control signal based on the transceiver control signalfrom the transceiver and a power supply control component configured togenerate a power supply control signal based on the transceiver controlsignal from the transceiver and to generate the power supply controlsignal based on a local control signal from the power amplifier controlcomponent.

In some embodiments, the interface can include one or more controlregisters. In some embodiments, the one or more control registers caninclude one or more power amplifier control registers and one or morepower supply control registers. In some embodiments, the power amplifiercontrol component can be configured to generate the power amplifiercontrol signal based on a portion of the transceiver control signalwritten to the one or more power amplifier control registers and thepower supply control component is configured to generate the powersupply control signal based on a portion of the transceiver controlsignal written to the one or more power supply control registers. Insome embodiments, the power amplifier control component can beconfigured to overwrite one or more of the power supply controlregisters with the local control signal.

In some embodiments, the power supply control component can have a firstinput coupled to the interface to receive at least a portion of thetransceiver control signal and a second input coupled to the poweramplifier control component to receive the local control signal from thepower amplifier control component.

In some embodiments, the power amplifier control signal can include atleast one of a bias voltage or an enable signal. In some embodiments,the power supply control signal can include at least one of a referencevoltage or an enable signal.

In some embodiments, the power supply control component can be furtherconfigured to generate the power supply control signal based on anexternal control signal from an alternate power amplifier controlcomponent.

In some embodiments, the power amplifier control component can beconfigured to generate the local control signal based on a sensedcondition of a power amplifier. In some embodiments, the sensedcondition of the power amplifier can be at least one of a saturationcondition or a safety condition.

In some implementations, the present disclosure relates to aradio-frequency (RF) module including a packaging substrate configuredto receive a plurality of components. The RF module includes a poweramplification system implemented on the packaging substrate. The poweramplification system includes a power amplifier configured to be poweredby a power supply and a control system. The control system is configuredto generate a power amplifier control signal to control the poweramplifier. The control system is further configured to generate a powersupply control signal to control the power supply.

In some embodiments, the RF module can be a front-end module (FEM).

In some embodiments, the power supply can be implemented on thepackaging substrate. In some embodiments, the power supply can include aswitching mode power supply. In some embodiments, the power supply caninclude a boost converter.

In some embodiments, the control system can include an interfaceconfigured to receive a transceiver control signal from a transceiver, apower amplifier control component generate the power amplifier controlsignal based on the transceiver control signal, and a power supplycontrol component configured to generate the power supply control signalbased on the transceiver control signal from the transceiver and togenerate the power supply control signal based on a local control signalfrom the power amplifier control component.

In some embodiments, the power supply control component can have a firstinput coupled to the interface to receive at least a portion of thetransceiver control signal and a second input coupled to the poweramplifier control component to receive the local control signal from thepower amplifier control component

In some implementations, the present disclosure relates to a wirelessdevice including a transceiver configured to generate a radio-frequency(RF) signal. The wireless device includes a front-end module (FEM) incommunication with the transceiver. The FEM includes a packagingsubstrate configured to receive a plurality of components. The FEMincludes a power amplification system implemented on the packagingsubstrate. The power amplification system includes a power amplifierconfigured to be powered by a power supply and amplify the RF signal.The power amplification system further includes a control systemconfigured to generate a power amplifier control signal to control thepower amplifier. The control system is further configured to generate apower supply control system to control the power supply. The wirelessdevice includes an antenna in communication with the FEM. The antenna isconfigured to transmit the amplified RF signal.

In some embodiments, the transceiver is not directly coupled to thepower supply.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an example wireless system or architecture.

FIG. 2 shows that, in some implementations, an amplification system caninclude a radio-frequency (RF) amplifier assembly having one or morepower amplifiers.

FIGS. 3A-3E show non-limiting examples of power amplifiers.

FIG. 4 illustrates a block diagram of a power amplificationconfiguration with independent power amplifier control and power supplycontrol.

FIG. 5 illustrates a block diagram of a power amplificationconfiguration with integrated power amplifier control and power supplycontrol.

FIG. 6 illustrates a block diagram of a power amplificationconfiguration with an example controller with integrated power amplifiercontrol and power supply control components.

FIG. 7 illustrates a block diagram of a power amplificationconfiguration with an example controller including control registers.

FIG. 8 shows an example of how the power supply of FIG. 7 can respond tothe various inputs of the reference voltage.

FIG. 9 depicts a module having one or more features as described herein.

FIG. 10 depicts a wireless device having one or more features describedherein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Referring to FIG. 1, one or more features of the present disclosuregenerally relate to a wireless system or architecture 50 having anamplification system 52. In some embodiments, the amplification system52 can be implemented as one or more devices, and such device(s) can beutilized in the wireless system/architecture 50. In some embodiments,the wireless system/architecture 50 can be implemented in, for example,a portable wireless device. Examples of such a wireless device aredescribed herein.

FIG. 2 shows that the amplification system 52 of FIG. 1 typicallyincludes a radio-frequency (RF) amplifier assembly 54 having one or morepower amplifiers (PAs). In the example of FIG. 2, three PAs 60 a-60 care depicted as forming the RF amplifier assembly 54. It will beunderstood that other numbers of PA(s) can also be implemented. It willalso be understood that one or more features of the present disclosurecan also be implemented in RF amplifier assemblies having other types ofRF amplifiers.

In some embodiments, the RF amplifier assembly 54 can be implemented onone or more semiconductor die, and such die can be included in apackaged module such as a power amplifier module (PAM) or a front-endmodule (FEM). Such a packaged module is typically mounted on a circuitboard associated with, for example, a portable wireless device.

The PAs (e.g., 60 a-60 c) in the amplification system 52 are typicallybiased by a bias system 56. Further, supply voltages for the PAs aretypically provided by a supply system 58. In some embodiments, either orboth of the bias system 56 and the supply system 58 can be included inthe foregoing packaged module having the RF amplifier assembly 54.

In some embodiments, the amplification system 52 can include a matchingnetwork 62. Such a matching network can be configured to provide inputmatching and/or output matching functionalities for the RF amplifierassembly 54.

For the purpose of description, it will be understood that each PA 60a-60 c of FIG. 2 can be implemented in a number of ways. FIGS. 3A-3Eshow non-limiting examples of how such a PA can be configured. FIG. 3Ashows an example PA having an amplifying transistor 64, where an inputRF signal (RF_in) is provided to a base of the transistor 64, and anamplified RF signal (RF_out) is output through a collector of thetransistor 64.

FIG. 3B shows an example PA having a plurality of amplifying transistors(e.g., 64 a, 64 b) arranged in stages. An input RF signal (RF_in) isprovided to a base of the first transistor 64 a, and an amplified RFsignal from the first transistor 64 a is output through its collector.The amplified RF signal from the first transistor 64 a is provided to abase of the second transistor 64 b, and an amplified RF signal from thesecond transistor 64 b is output through its collector to thereby yieldan output RF signal (RF_out) of the PA.

In some embodiments, the foregoing example PA configuration of FIG. 3Bcan be depicted as two or more stages as shown in FIG. 3C. The firststage 64 a can be configured as, for example, a driver stage; and thesecond stage 64 b can be configured as, for example, an output stage.

FIG. 3D shows that in some embodiments, a PA can be configured as aDoherty PA. Such a Doherty PA can include amplifying transistors 64 a,64 b configured to provide carrier amplification and peakingamplification of an input RF signal (RF_in) to yield an amplified outputRF signal (RF_out). The input RF signal can be split into the carrierportion and the peaking portion by a splitter. The amplified carrier andpeaking signals can be combined to yield the output RF signal by acombiner.

FIG. 3E shows that in some embodiments, a PA can be implemented in acascode configuration. An input RF signal (RF_in) can be provided to abase of the first amplifying transistor 64 a operated as a commonemitter device. The output of the first amplifying transistor 64 a canbe provided through its collector and be provided to an emitter of thesecond amplifying transistor 64 b operated as a common base device. Theoutput of the second amplifying transistor 64 b can be provided throughits collector so as to yield an amplified output RF signal (RF_out) ofthe PA.

In the various examples of FIGS. 3A-3E, the amplifying transistors aredescribed as bipolar junction transistors (BJTs) such as heterojunctionbipolar transistors (HBTs). It will be understood that one or morefeatures of the present disclosure can also be implemented in or withother types of transistors such as field-effect transistors (FETs).

In some embodiments, the amplification system 52 of FIG. 2 can beimplemented as a high-voltage (HV) power amplification system. Such asystem can include an HV power amplifier assembly configured to includeHV amplification operation of some or all of the PAs (e.g., 60 a-60 c).As described herein, such PAs can be biased by a bias system. In someembodiments, the foregoing HV amplification operation can be facilitatedby an HV supply system. Such an HV supply system can include, forexample a switching mode power supply (SMPS). In some embodiments, a PAmaster system can be implemented. Such a PA master system can include acontrol component for controlling some or all of the PAs. The controlcomponent can also be configured to provide at least some control of theSMPS. Although various examples are described herein in the context ofHV operations, it will be understood that one or more features of thepresent disclosure can also be implemented in non-HV applications.

FIG. 4 illustrates a block diagram of a power amplificationconfiguration 400 with independent power amplifier control and powersupply control. The power amplification configuration 400 can beimplemented in, for example, a hand-held mobile device. The poweramplification configuration 400 includes a power amplifier (PA) 422 anda power supply (PS) 412. In some embodiments, the power supply 412 caninclude a switching mode power supply (SMPS), such as a boost converter,a buck converter, a buck-boost converter, a charge pump, etc.

The power supply 412 receives an input voltage (e.g., Vbatt from abattery or from another source) and supplies a supply voltage (Vcc) tothe power amplifier 422. The power amplifier 422 is powered by thesupply voltage. The magnitude of the supply voltage can be set by apower supply control signal received by the power supply 412 andprovided by a power supply controller 411. The power supply controller411 can generate the power supply control signal based on a transceivercontrol signal received from a transceiver 401.

The power amplifier 422 receives an input signal (RFin) and supplies, asan output signal (RFout), an amplified version of the input signal. Theinput signal can be received from a power amplifier controller 421 thatreceives the signal from the transceiver 401 (as shown in FIG. 4), canbe received directly from the transceiver 401, or can be received fromanother source. The power amplifier 422 is biased by power amplifiercontrol signal (e.g., a bias signal such as a bias voltage or a biascurrent) received by the power amplifier 422 and provided by the poweramplifier controller 421. The power amplifier controller 421 cangenerate the power amplifier control signal based on a transceivercontrol signal received from the transceiver 401. The power amplifiercontroller 421 and power amplifier 422 can be integrated onto a singlemodule 420. In particular, the power amplifier controller 421 and poweramplifier 422 can be integrated on a single die. In someimplementations, the power supply 412 can also be integrated onto themodule or integrated on the die.

Thus, the power supply 412 and the power amplifier 422 are controlledindependently by the transceiver 401. As a result, there is limitedability for the power supply to be adjusted as a function of theoperating conditions of the power amplifier 422. In some configurations,control of the power amplifier 422 and the power supply 412 can beaccomplished through fixed conditions. As an example, a system requestfor a specified output power drives a setup condition for the poweramplifier 422 and the power supply 412 based upon a pre-determinedtable.

In some configurations, additional interface signals between the poweramplifier 422 and the transceiver 401 (e.g., via the power amplifiercontroller 421) allow sensing of power amplifier outputs such that thetransceiver 401 can change the operating state of the power supply 401based upon these sensed conditions. For example, in response to a sensedcondition of the power amplifier 422, the power amplifier controller 421can send a request to the transceiver 401 to increase the supplyvoltage. In response, the transceiver 401 can send a transceiver controlsignal to the power supply controller 411 which can, in turn, send apower supply control signal to the power supply 412 to increase thesupply voltage (Vcc).

In some embodiments, as described in detail below, some or all of thepower supply control features can be integrated with some or all of thepower amplifier control features. Such an integration can allow thepower supply to respond to inputs from the transceiver, from the poweramplification module directly, or any combination thereof. For example,internal monitoring within the power amplifier control function cangenerate one or more outputs which can be utilized to directly controlthe power supply and adjust the supply voltage applied to the poweramplifier without any required knowledge by the transceiver.

Integration of power supply and power amplifier control features canprovide significant advantages. For example, customizations for thetransceiver system or software are not required in order to support moreadvanced features associated with supplying of power to power amplifier.In some embodiments, traditional setup conditions can provided by thetransceiver, while the power supply can then be adjusted based upon oneor more specific parameters required or desired by the associated poweramplifier.

FIG. 5 illustrates a block diagram of a power amplificationconfiguration 500 with integrated power amplifier control and powersupply control. Such integration can allow, for example, interactionbetween the power amplifier 522 and power supply 512 without input fromor interaction with the transceiver 501. In particular, the transceiver501 is not directly coupled to the power supply 512 and is not coupledto the power supply 512 via a dedicated power supply controller.

The power amplification configuration 500, like the configuration 400 ofFIG. 4, includes a power amplifier 522 and a power supply 512. In someembodiments, the power supply 512 can include a switching mode powersupply (SMPS), such as a boost converter, a buck converter, a buck-boostconverter, a charge pump, etc.

The power supply 512 receives an input voltage (e.g., Vbatt from abattery or from another source) and supplies a supply voltage (Vcc) tothe power amplifier 522. The power amplifier 522 is powered by thesupply voltage. The magnitude of the supply voltage can be set by apower supply control signal received by the power supply 512 andprovided by an integrated controller 521. The controller 521 cangenerate the power supply control signal based on a transceiver controlsignal received from a transceiver 501 or based on a sensed condition ofthe power amplifier 522.

The power amplifier 522 receives an input signal (RFin) and supplies, asan output signal (RFout), an amplified version of the input signal. Theinput signal can be received from the controller 521 that receives thesignal from the transceiver 501 (as shown in FIG. 5), can be receiveddirectly from the transceiver 501, or can be received from anothersource. The power amplifier 522 is biased by power amplifier controlsignal (e.g., a bias signal such as a bias voltage or a bias current)received by the power amplifier 522 and provided by the controller 521.The power amplifier controller 521 can generate the power amplifiercontrol signal based on a transceiver control signal received from thetransceiver 501. The controller 521 and power amplifier 522 can beintegrated onto a single module 520, referred to herein as a PA master.In particular, the controller 521 and power amplifier 522 can beintegrated on a single die. In some implementations, the power supply512 can also be integrated onto the module or integrated on the die.

FIG. 6 illustrates a block diagram of a power amplificationconfiguration 600 with an example controller 621 with integrated poweramplifier control and power supply control components 632, 633. Thepower amplification configuration 600, like the configuration 500 ofFIG. 5, includes a power amplifier 622 and a power supply 612. In someembodiments, the power supply 612 can include a switching mode powersupply (SMPS), such as a boost converter, a buck converter, a buck-boostconverter, a charge pump, etc.

The power supply 612 receives an input voltage (e.g., Vbatt from abattery or from another source) and supplies a supply voltage (Vcc) tothe power amplifier 622. The power amplifier 622 is powered by thesupply voltage. The magnitude of the supply voltage can be set by apower supply control signal received by the power supply 612 andprovided by a controller 621. In particular, the power supply controlsignal can be provided by the power supply control component 632 of thecontroller 621. The power supply control component 632 can generate thepower supply control signal based on a transceiver control signalreceived from a transceiver 501 via an interface 631 or based on localcontrol signal received from the power amplifier control component 633.The local control signal can be, for example, based on sensed conditionof the power amplifier 622. As shown in FIG. 6, the power supply controlcomponent 632 includes a first input coupled to the interface 631 toreceive at least a portion of the transceiver control signal and asecond input coupled to the power amplifier control component 633 toreceive the local control signal from the power amplifier controlcomponent 633.

The power amplifier 622 receives an input signal (RFin) and supplies, asan output signal (RFout), an amplified version of the input signal. Theinput signal can be received from the power amplifier control component633 that receives the signal from the transceiver 601 via the interface631 (as shown in FIG. 6), can be received directly from the transceiver601, or can be received from another source. The power amplifier 622 isbiased by power amplifier control signal (e.g., a bias signal such as abias voltage or a bias current) received by the power amplifier 622 andprovided by the power amplifier control component 633. The poweramplifier control component 633 can generate the power amplifier controlsignal based on a transceiver control signal received from thetransceiver 601 via the interface 631. The controller 621 and poweramplifier 622 can be integrated onto a single module 620, referred toherein as a PA master. In particular, the controller 621 and poweramplifier 622 can be integrated on a single die. In someimplementations, the power supply 612 can also be integrated onto themodule or integrated on the die.

Thus, the power amplification configuration 600 of FIG. 6 includes apower amplification control system including the controller 621. Thecontroller 621 includes an interface 631 configured to receive atransceiver control signal from the transceiver 601. The controller 621includes a power amplifier control component 633 configured to generatea power amplifier control signal based on the transceiver control signalfrom the transceiver 601 and a power supply control component 632configured to generate a power supply control signal based on thetransceiver control signal from the transceiver 601 and to generate thepower supply control signal based on a local control signal from thepower amplifier control component 633.

In some embodiments, the power amplifier control signal supplied to thepower amplifier 622 by the power amplifier control component 633includes a bias voltage for biasing the power amplifier 622. In someembodiments, the power amplifier control signal includes an enablesignal for enabling (or disabling) the power amplifier 622.

In some embodiments, the power supply control signal supplied to thepower supply 612 by the power supply control component 632 includes areference voltage that indicates a magnitude of the supply voltage to beprovided to the power amplifier 622. In some embodiments, the powersupply control signal includes an enable signal for enabling (ordisabling) the power supply 612.

In some embodiments, the local control signal supplied to the powersupply control component 632 by the power amplifier control component633 indicates that the supply voltage is to be increased. In someembodiments, the local control signal indicates that the supply voltageis to be decreased. In some embodiments, the local control signalindicates that the power supply 612 is to be disabled.

In some embodiments, the local control signal is based on a sensedcondition of the power amplifier 622. The sensed condition can be asaturation condition or a safety condition. For example, the poweramplifier control component 633 can detect that the power amplifier 622(or one or more transistors of the power amplifier 622) is saturated. Inresponse, the power amplifier control component 633 can provide a localcontrol signal to the power supply control component 632 indicating thatthe supply voltage is to be increased. As another example, the poweramplifier control component 633 can detect that the power amplifier 622is operating in (or approaching operation in) an unsafe condition thatcould lead to damage to the power amplifier 622. In response, the poweramplifier control component 633 can provide a local control signal tothe power supply control component 632 indicating that the supplyvoltage is to be decreased or the power supply 612 is to be disabled.

FIG. 7 illustrates a block diagram of a power amplificationconfiguration 700 with an example controller 621 including controlregisters 731. The power amplification configuration 700 includes apower amplifier 722 and a switching mode power supply (SMPS) 712. Theswitching mode power supply can include a boost converter, a buckconverter, a buck-boost converter, a charge pump, etc. The poweramplifier 722 can be a high-voltage power amplifier.

The SMPS 712 receives an input voltage (e.g., from a battery or fromanother source) and supplies a supply voltage at an output to the poweramplifier 722. The power amplifier 722 is powered by the supply voltage.The magnitude of the supply voltage can be set by a power supply controlsignal received by the power supply 712 and provided by a controller721. In particular, the power supply control signal can be provided byan SMPS control component 732 of the controller 721. The power supplycontrol signal can be converted from a digital signal to an analogreference voltage (Vref) by a digital-to-analog converter 734. The SMPScontrol component 732 can generate the power supply control signal basedon a transceiver control signal received from a modem/transceiver (notshown) via an interface 731 or based on local control signal receivedfrom a power amplifier bias control component 733. The local controlsignal can be, for example, based on sensed condition of the poweramplifier 722. As shown in FIG. 7, the SMPS control component 732includes a first input coupled to the interface 731 to receive at leasta portion of the transceiver control signal and a second input coupledto the power amplifier bias control component 733 to receive the localcontrol signal from the power amplifier bias control component 733.

The SMPS control component 732 can also generate the power supplycontrol signal based on an external control signal received from analternate PA module 750 including a power amplifier power by the supplyvoltage of the SMPS 712. In particular, the external control signal canbe received from a power amplifier control component (e.g., a poweramplifier bias control component) of the alternate PA module 750.

The power amplifier 722 receives an input signal (RFin) and supplies, asan output signal (RFout), an amplified version of the input signal. Theinput signal can be received from the power amplifier bias controlcomponent 733 that receives the signal from the transceiver via theinterface 731 (as shown in FIG. 7), can be received directly from thetransceiver, or can be received from another source (such as anotherpower amplifier control component). The power amplifier 722 is biased bypower amplifier control signal (e.g., a bias signal such as a biasvoltage or a bias current) received by the power amplifier 722 andprovided by the power amplifier bias control component 733. The poweramplifier bias control component 733 can generate the power amplifiercontrol signal based on a transceiver control signal received from thetransceiver via the interface 731. The controller 721 and poweramplifier 722 can be integrated onto a single module 720, referred toherein as a PA master. In particular, the controller 721 and poweramplifier 722 can be integrated on a single die. In someimplementations, the power supply 712 can also be integrated onto themodule or integrated on the die.

The interface 731 of the controller 721 includes one or more controlregisters. The control registers can be, for example, MIPI® controlregisters. In particular, as shown in FIG. 7, the interface 731 includesone or more power amplifier control registers and one or more powersupply control registers. The interface 731 further includes one-timeprogrammable (OTP) memory.

The power amplifier bias control component 733 is configured to generatethe power amplifier control signal based on a portion of the transceivercontrol signal written to the one or more power amplifier controlregisters and the SMPS control component 732 is configured to generatethe power supply control signal based on a portion of the transceivercontrol signal written to the one or more power supply controlregisters. In some embodiments, the power amplifier bias controlcomponent 733 is configured to overwrite one or more of the power supplycontrol registers with the local control signal. Thus, the local controlsignal can be provided, in some implementations, to the SMPS controlcomponent 732 via the interface 731.

The interface 731 can include an input/output voltage (VIO) pin, a clock(CLK) pin, a ground (GND) pin, and a data pin. The transceiver controlsignal can be transmitted from the modem/transceiver (and written to thecontrol registers) via the data pin.

Thus, the power amplification configuration 700 of FIG. 7 includes apower amplification control system including the controller 721. Thecontroller 721 includes an interface 731 configured to receive atransceiver control signal from the transceiver. The controller 721includes a power amplifier control component (e.g., the power amplifierbias control component 733) configured to generate a power amplifiercontrol signal (e.g., a bias voltage) based on the transceiver controlsignal from the transceiver and a power supply control component (e.g.,the SMPS control component 732) configured to generate a power supplycontrol signal (e.g., the reference voltage) based on the transceivercontrol signal from the transceiver and to generate the power supplycontrol signal based on a local control signal from the power amplifiercontrol component.

Table 1 lists examples of control signals that can be generated by theSMPS control component 732 by using a 3-bit signal (which can be writtento one of the SMPS control registers) to generate various values ofVref. Table 1 illustrates that a number of operating modes can beimplemented with varying values of Vref, including a disable mode. Inthe “Boost” mode, the specific Vref output can be indicated using avalue written to another of the SMPS control registers.

TABLE 1 Control Control Control B2 B1 Bit B0 Mode Vref output 0 0 0Disable 0 0 1 0 Forced Bypass 0.6 0 1 1 Boost >0.8 1 0 0 2G Bias <0.3 10 1 Reserved NA 1 1 0 Reserved NA 1 1 1 Reserved NA

FIG. 8 shows an example of how the SMPS 712 of FIG. 7 can respond to thevarious inputs of the reference voltage Vref, some of which are listedin Table 1. In the 2G bias mode (Vref <0.3V), the SMPS can output avoltage suitable for 2G biasing purpose. In the buck mode (Vref between0.3V and 0.4V), the SMPS can output a voltage that is, for example, halfof the battery voltage. In the bypass mode (Vref between 0.4V and 0.8V),the SMPS can output a voltage that is substantially equal to the batteryvoltage. In the boost mode (Vref >0.8V), the SMPS can output a boostedvoltage that is proportional to Vref. Such an output can be utilized as,for example, a supply voltage for one or more PAs operating in HV mode.

FIG. 9 shows that in some embodiments, some or all of the integrated PAmaster functionalities described herein can be implemented in a module.Such a module can be, for example, a front-end module (FEM). In theexample of FIG. 9, a module 300 can include a packaging substrate 302,and a number of components can be mounted on such a packaging substrate.For example, an FE-PMIC component 302, a power amplifier assembly 306including a PA master 307, a match component 308, and a duplexerassembly 310 can be mounted and/or implemented on and/or within thepackaging substrate 302. Other components such as a number of SMTdevices 314 and an antenna switch module (ASM) 312 can also be mountedon the packaging substrate 302. Although all of the various componentsare depicted as being laid out on the packaging substrate 302, it willbe understood that some component(s) can be implemented over othercomponent(s).

In some implementations, a device and/or a circuit having one or morefeatures described herein can be included in an RF device such as awireless device. Such a device and/or a circuit can be implementeddirectly in the wireless device, in a modular form as described herein,or in some combination thereof. In some embodiments, such a wirelessdevice can include, for example, a cellular phone, a smart-phone, ahand-held wireless device with or without phone functionality, awireless tablet, etc.

FIG. 10 depicts an example wireless device 200 having one or moreadvantageous features described herein. In the context of a modulehaving one or more features as described herein, such a module can begenerally depicted by a dashed box 300, and can be implemented as, forexample, a front-end module (FEM). Such a module can include a PA master307 having one or more features as described herein.

Referring to FIG. 10, power amplifiers (PAs) 220 can receive theirrespective RF signals from a transceiver 210 that can be configured andoperated in known manners to generate RF signals to be amplified andtransmitted, and to process received signals. The transceiver 210 isshown to interact with a baseband sub-system 208 that is configured toprovide conversion between data and/or voice signals suitable for a userand RF signals suitable for the transceiver 210. The transceiver 210 canalso be in communication with a power management component 206 that isconfigured to manage power for the operation of the wireless device 200.Such power management can also control operations of the basebandsub-system 208 and the module 300.

The baseband sub-system 208 is shown to be connected to a user interface202 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 208 can also beconnected to a memory 204 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

In the example wireless device 200, outputs of the PAs 220 are shown tobe matched (via respective match circuits 222) and routed to theirrespective duplexers 220. Such amplified and filtered signals can berouted to an antenna 216 through an antenna switch 214 for transmission.In some embodiments, the duplexers 220 can allow transmit and receiveoperations to be performed simultaneously using a common antenna (e.g.,216). In FIG. 10, received signals are shown to be routed to “Rx” paths(not shown) that can include, for example, a low-noise amplifier (LNA).

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Description using the singularor plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A power amplification control system comprising: an interface configured to receive a transceiver control signal from a transceiver; a power amplifier control component configured to generate a power amplifier control signal based on the transceiver control signal from the transceiver; and a power supply control component configured to generate a power supply control signal based on the transceiver control signal from the transceiver and to generate the power supply control signal based on a local control signal from the power amplifier control component. 